Volume 4, Issue 3 (Summer &Autumn 2007 2007)                   IJMSE 2007, 4(3): 14-21 | Back to browse issues page

XML Print


Download citation:
BibTeX | RIS | EndNote | Medlars | ProCite | Reference Manager | RefWorks
Send citation to:
Mendeley  
Zotero  
RefWorks

H. Ghasemi, M. A. Faghihi Sani, Z. Riazi. AN INFLUENCE OF PHASE DEVELOPMENT ON MECHANICAL STRENGTH OF ALUMINA-COPPER JOINT PREPARED BY MOLYMn METHOD. IJMSE 2007; 4 (3) :14-21
URL: http://ijmse.iust.ac.ir/article-1-119-en.html
Abstract:   (29071 Views)
Abstract: The effect of phase development on peel strength of alumina-copper metalized joint has been investigated. The alumina-copper joint was prepared in three stages. The alumina substrate was, first, metalized at 1500°C in H2-furnace by a new formulation. In the second step, a nickel layer was electroplated on the metalized layer with approximately 10µm thickness. Finally, copper strips were bonded to metalized alumina with Ag-Cu (72-28) filler metal. The peel strength of the joint was 9.5±0.5 Kg/cm which shows approximately 30% increase in comparison to previous works. By study of fracture surface and crack propagation path, it has been concluded that this increase is due to the formation of more spinel phase.
     
Type of Study: Research Paper |

Add your comments about this article : Your username or Email:
CAPTCHA

Send email to the article author


Rights and permissions
Creative Commons License This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.